The position of the leads on an electronic component is important for getting a satisfactory solder mount of the component to an electronic printed circuit board. There is concern that an electronic tester of the component function is bending the component leads. To monitor physical changes from tester handling, the leads from a sample of components are noted before and after the tester.
(a) Create a plan for implementing a DOE that assesses what should be done differently to reduce the amount of bending on each component. Consider the selection of measurement response, selection of factors, and results validation.
(b) Create a plan that could be used in the future for a similar machine setup.
