1. Explain the Tooling and Moulding techniques used for product enclosure development.

2. Explain the Sheet Metal based product enclosure development. 3. Which of the following is not in the scope of EDLC

(a) Maximise Return on Investment (RoI)

(b) Minimise the risks involved in the product development

(c) Advertise the product

(d) Defect prevention in Product development

4. The term ‘model’ in EDLC represents

(a) The various phases in the life cycle of the product

(b) The various analysis of the product

(c) The various designs of the product

(d) The various architecture of the product

5. Which of the following is(are) a driving factor(s) for ‘Product Re-engineering’?

(a) Change in business requirement (b) User interface enhancements

(c) Technology upgrades (d) All of these

(e) (a) and (b) (f) (a) and (c)

6. An embedded product requires interfacing with another subsystem of an enterprise for data logging and information exchange. The interface for this is defi ned during?

(a) Conceptualisation phase (b) Requirement analysis phase

(c) Design phase (d) Development phase

(e) Deployment phase

7. An embedded product requires a TCP/IP interface and it is decided that the TCP/IP interface can be implemented using Commercial of the Shelf (COTS) component. The COTS module for the TCP/IP Module is fi nalised and selected during?

(a) Conceptualisation phase (b) Requirement analysis phase

(c) Design phase (d) Development phase

(e) Deployment phase

8. An embedded product contains LCD interfacing and a developer is assigned to work on this module. The developer coded the module and tested its functioning using a simulator. The test performed by the developer falls under?

(a) Integration Testing (b) Unit Testing

(c) System Testing (d) Acceptance Testing